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      <title><![CDATA[France-Pra-Loup: Integrated circuit sockets or mounts]]></title>
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      <title><![CDATA[Integrated Circuit Chip Tape-out and Verification at Southeast University (CMOS 65nm MPW Integrated Circuit Chip Tape-out and Testing Verification, School of Integrated Circuits) - 3004456]]></title>
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      <title><![CDATA[Photonic Integrated Circuit Architectures for Scalable System Objectives (PICASSO) - DARPA-PS-26-13]]></title>
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      <title><![CDATA[Public Tender Announcement for the Procurement of Ultrapure Water System Equipment by the School of Integrated Circuits, Peking University - 7813372]]></title>
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      <title><![CDATA[Southeast University School of Integrated Circuits High and Low Temperature Vacuum Probe Station Procurement Project - 7814093]]></title>
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      <title><![CDATA[Photonic Integrated Circuit Architectures for Scalable System Objectives (PICASSO) - DARPA-PS-26-13]]></title>
      <description><![CDATA[Publish Date: 2026/02/10<br/>Closing Date: <br/>Country: United States]]></description>
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      <title><![CDATA[Photonic Integrated Circuit Architectures for Scalable System Objectives (PICASSO) - DARPA-PS-26-13]]></title>
      <description><![CDATA[Publish Date: 2026/01/28<br/>Closing Date: 2026/03/06<br/>Country: United States]]></description>
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      <title><![CDATA[Procurement Project for Integrated Circuit Packaging, Screening and Testing Services by the Institute of Microelectronics, Chinese Academy of Sciences - 2003457]]></title>
      <description><![CDATA[Publish Date: 2026/01/25<br/>Closing Date: <br/>Country: China ]]></description>
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      <description><![CDATA[Publish Date: 2026/01/07<br/>Closing Date: 2026/01/19<br/>Country: Singapore]]></description>
      <pubDate>Tue, 06 Jan 2026 22:45:22 GMT</pubDate>
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      <title><![CDATA[Procurement of Microstructure Optical Characterization Platform by the School of Integrated Circuits, Southeast University- 7900580]]></title>
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      <pubDate>Tue, 06 Jan 2026 21:22:11 GMT</pubDate>
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      <title><![CDATA[Supply of Electronic Components-Digital Integrated Circuits- 9000972]]></title>
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      <title><![CDATA[RF integrated circuit fabrication services at South China University of Technology - 7011301]]></title>
      <description><![CDATA[Publish Date: 2025/12/29<br/>Closing Date: <br/>Country: China ]]></description>
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      <title><![CDATA[TPO-REQ-2025-008266-SH-Invitation to Quote for Three-Year Subscription of Semiconductor Simulation and Integrated Circuit Design Software License - 9022735]]></title>
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      <title><![CDATA[Xiamen University Xiang'an Campus Integrated Circuit R&D Building (Building A and Building B) Project (Design Evaluation Separation) - 7814491]]></title>
      <description><![CDATA[Publish Date: 2025/12/18<br/>Closing Date: <br/>Country: China ]]></description>
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      <title><![CDATA[Huazhong University of Science and Technology Procurement Project for Integrated Circuit Packaging Process Equipment - 2035703]]></title>
      <description><![CDATA[Publish Date: 2025/12/16<br/>Closing Date: <br/>Country: China ]]></description>
      <pubDate>Mon, 15 Dec 2025 22:27:47 GMT</pubDate>
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      <title><![CDATA[Procurement of power system materials for the integrated circuit R&D line of the School of Integrated Circuit Science and Engineering, Beijing University of Aeronautics and Astronautics - 2036393]]></title>
      <description><![CDATA[Publish Date: 2025/12/16<br/>Closing Date: 2026/01/06<br/>Country: China ]]></description>
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      <title><![CDATA[Two High-Temperature MCU Integrated Circuit Custom Development Procurement Projects by the Institute of Microelectronics, Chinese Academy of Sciences - 2038158]]></title>
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      <title><![CDATA[High Vacuum Evaporation Coating System, School of Integrated Circuits, Southeast University - 3004037]]></title>
      <description><![CDATA[Publish Date: 2025/12/12<br/>Closing Date: <br/>Country: China ]]></description>
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      <title><![CDATA[Supply and delivery of RF Transistors, Integrated Circuits and consumables for repair of Toshiba DVOR - 12671426]]></title>
      <description><![CDATA[Publish Date: 2025/12/09<br/>Closing Date: 2025/12/12<br/>Country: Philippines]]></description>
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      <description><![CDATA[Publish Date: 2025/12/04<br/>Closing Date: <br/>Country: China ]]></description>
      <pubDate>Wed, 03 Dec 2025 22:18:04 GMT</pubDate>
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      <title><![CDATA[Supply of Electronic Components-Integrated Circuits - 4295377]]></title>
      <description><![CDATA[Publish Date: 2025/12/01<br/>Closing Date: 2025/12/22<br/>Country: India]]></description>
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      <title><![CDATA[Procurement of magnetron sputtering targets for the School of Integrated Circuits, Southeast University - 6702368]]></title>
      <description><![CDATA[Publish Date: 2025/11/18<br/>Closing Date: <br/>Country: China ]]></description>
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      <title><![CDATA[High and Low Temperature Vacuum Probe Station, School of Integrated Circuits, Southeast University - 5731955]]></title>
      <description><![CDATA[Publish Date: 2025/11/13<br/>Closing Date: <br/>Country: China ]]></description>
      <pubDate>Thu, 13 Nov 2025 15:07:19 GMT</pubDate>
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      <title><![CDATA[Tsinghua University Integrated Circuit High-Precision Automatic Die Bonding Machine Procurement Project - 5305917]]></title>
      <description><![CDATA[Publish Date: 2025/11/11<br/>Closing Date: 2025/11/27<br/>Country: China ]]></description>
      <pubDate>Mon, 10 Nov 2025 22:27:20 GMT</pubDate>
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      <title><![CDATA[Tsinghua University Integrated Circuit High-Precision Automatic Die Bonding Machine Procurement Project - 7104450]]></title>
      <description><![CDATA[Publish Date: 2025/11/07<br/>Closing Date: 2025/11/27<br/>Country: China ]]></description>
      <pubDate>Fri, 07 Nov 2025 12:38:19 GMT</pubDate>
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      <title><![CDATA[Supply of electronic components and boards (cards with embedded integrated circuits (smart cards). - 6012738]]></title>
      <description><![CDATA[Publish Date: 2025/11/07<br/>Closing Date: 2025/11/13<br/>Country: Russia]]></description>
      <pubDate>Thu, 06 Nov 2025 23:44:45 GMT</pubDate>
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      <title><![CDATA[Procurement of a multi-mode deposition coating system for integrated circuit dielectric materials at the University of Science and Technology Beijing - 9053320]]></title>
      <description><![CDATA[Publish Date: 2025/10/24<br/>Closing Date: <br/>Country: China ]]></description>
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      <title><![CDATA[Procurement of ultra-high vacuum interconnect physical deposition coating system for integrated circuit electrode materials at the University of Science and Technology Beijing - 9053368]]></title>
      <description><![CDATA[Publish Date: 2025/10/24<br/>Closing Date: <br/>Country: China ]]></description>
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      <title><![CDATA[Beihang University School of Integrated Circuit Science and Engineering 2025 28nm Chip Wafer Tape Project - 9112345]]></title>
      <description><![CDATA[Publish Date: 2025/10/22<br/>Closing Date: <br/>Country: China ]]></description>
      <pubDate>Tue, 21 Oct 2025 22:39:15 GMT</pubDate>
      <dc:creator>Bidding Source</dc:creator>
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      <link>https://www.biddingsource.com/tenders/9412410</link>
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      <title><![CDATA[Southeast University School of Integrated Circuits Chip Performance Verification Equipment Procurement - 9114580]]></title>
      <description><![CDATA[Publish Date: 2025/10/22<br/>Closing Date: 2025/11/07<br/>Country: China ]]></description>
      <pubDate>Tue, 21 Oct 2025 22:48:47 GMT</pubDate>
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      <title><![CDATA[12nm multi-project wafer MPW tapeout project of the School of Integrated Circuit Science and Engineering, Beihang University - 2240042]]></title>
      <description><![CDATA[Publish Date: 2025/10/17<br/>Closing Date: <br/>Country: China ]]></description>
      <pubDate>Thu, 16 Oct 2025 22:43:04 GMT</pubDate>
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      <link>https://www.biddingsource.com/tenders/9376180</link>
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      <title><![CDATA[Southeast University School of Integrated Circuits Cell Library Characterization Tool Software Procurement Project - 2242594]]></title>
      <description><![CDATA[Publish Date: 2025/10/17<br/>Closing Date: <br/>Country: China ]]></description>
      <pubDate>Thu, 16 Oct 2025 22:52:02 GMT</pubDate>
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      <title><![CDATA[Renovation of the ultra-clean laboratory of the School of Integrated Circuits - 7903250]]></title>
      <description><![CDATA[Publish Date: 2025/10/02<br/>Closing Date: 2025/10/22<br/>Country: China ]]></description>
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      <link>https://www.biddingsource.com/tenders/9294857</link>
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      <title><![CDATA[Purchase of Patient Monitor, High Speed ​​Large Bone Drill, High Frequency Electric Scalpel, High Frequency Electric Scalpel with Integrated Circuit Welding Knife (Circuit Welding Knife) (belongs to P3) - 8999506]]></title>
      <description><![CDATA[Publish Date: 2025/09/30<br/>Closing Date: 2025/10/17<br/>Country: Vietnam]]></description>
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      <title><![CDATA[Construction of a clean laboratory on the first floor of Building 4, School of Integrated Circuit Science and Engineering, Beihang University - 8001790]]></title>
      <description><![CDATA[Publish Date: 2025/09/30<br/>Closing Date: <br/>Country: China ]]></description>
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      <link>https://www.biddingsource.com/tenders/9211293</link>
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      <title><![CDATA[China - 12nm multi-project wafer MPW tapeout project of the School of Integrated Circuit Science and Engineering, Beihang University - 6093368]]></title>
      <description><![CDATA[Publish Date: 2025/09/17<br/>Closing Date: 2025/10/10<br/>Country: China ]]></description>
      <pubDate>Wed, 17 Sep 2025 14:21:12 GMT</pubDate>
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      <link>https://www.biddingsource.com/tenders/9211313</link>
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      <title><![CDATA[China - Nanjing University School of Integrated Circuits Experimental Site Deepening and Adjustment Project - 6095463]]></title>
      <description><![CDATA[Publish Date: 2025/09/17<br/>Closing Date: <br/>Country: China ]]></description>
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      <link>https://www.biddingsource.com/tenders/9196481</link>
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      <title><![CDATA[Construction of a clean laboratory on the first floor of Building 4, School of Integrated Circuit Science and Engineering, Beihang University - 6705167]]></title>
      <description><![CDATA[Publish Date: 2025/09/16<br/>Closing Date: <br/>Country: China ]]></description>
      <pubDate>Tue, 16 Sep 2025 00:07:12 GMT</pubDate>
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      <link>https://www.biddingsource.com/tenders/9159000</link>
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      <title><![CDATA[Southeast University School of Integrated Circuits Hardware Accelerator Procurement - 7787399]]></title>
      <description><![CDATA[Publish Date: 2025/09/09<br/>Closing Date: 2025/09/28<br/>Country: China ]]></description>
      <pubDate>Mon, 08 Sep 2025 23:41:52 GMT</pubDate>
      <dc:creator>Bidding Source</dc:creator>
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      <category><![CDATA[Electronic integrated circuits and microassemblies Tenders]]></category>
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      <link>https://www.biddingsource.com/tenders/9159011</link>
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      <title><![CDATA[Special MPW2025 tape-out service fee for the School of Integrated Circuit Science and Engineering, Beihang University - 7787410]]></title>
      <description><![CDATA[Publish Date: 2025/09/09<br/>Closing Date: <br/>Country: China ]]></description>
      <pubDate>Mon, 08 Sep 2025 23:41:56 GMT</pubDate>
      <dc:creator>Bidding Source</dc:creator>
      <category><![CDATA[Integrated circuit packages Tenders]]></category>
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      <category><![CDATA[Electronic integrated circuits and microassemblies Tenders]]></category>
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      <link>https://www.biddingsource.com/tenders/9121397</link>
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      <title><![CDATA[Nanjing University School of Integrated Circuits Experimental Site Deepening and Adjustment Project - 7785262]]></title>
      <description><![CDATA[Publish Date: 2025/09/04<br/>Closing Date: <br/>Country: China ]]></description>
      <pubDate>Wed, 03 Sep 2025 23:03:19 GMT</pubDate>
      <dc:creator>Bidding Source</dc:creator>
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      <category><![CDATA[Electronic integrated circuits and microassemblies Tenders]]></category>
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      <link>https://www.biddingsource.com/tenders/9122823</link>
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      <title><![CDATA[Southeast University School of Integrated Circuits Procurement of Film Laminating Machine - 7786692]]></title>
      <description><![CDATA[Publish Date: 2025/09/04<br/>Closing Date: 2025/09/23<br/>Country: China ]]></description>
      <pubDate>Wed, 03 Sep 2025 23:10:24 GMT</pubDate>
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      <category><![CDATA[Electronic integrated circuits and microassemblies Tenders]]></category>
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      <link>https://www.biddingsource.com/tenders/9122835</link>
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      <title><![CDATA[Special MPW2025 tape-out service fee for the School of Integrated Circuit Science and Engineering, Beihang University - 7786704]]></title>
      <description><![CDATA[Publish Date: 2025/09/04<br/>Closing Date: <br/>Country: China ]]></description>
      <pubDate>Wed, 03 Sep 2025 23:10:25 GMT</pubDate>
      <dc:creator>Bidding Source</dc:creator>
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      <category><![CDATA[Electronic integrated circuits and microassemblies Tenders]]></category>
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      <link>https://www.biddingsource.com/tenders/9094131</link>
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      <title><![CDATA[Acquisition of electronic cards with contactless integrated circuit (Contactless Smart Card), with 1K and 4K memory, MIFARE ISO/IEC 14443 A/B standard, as requested by the Foztrans Public Transport Division, intended for use in the SBE Electronic Ticketing System - 7833724]]></title>
      <description><![CDATA[Publish Date: 2025/09/01<br/>Closing Date: <br/>Country: Brazil]]></description>
      <pubDate>Sun, 31 Aug 2025 23:13:09 GMT</pubDate>
      <dc:creator>Bidding Source</dc:creator>
      <category><![CDATA[Integrated circuit lids Tenders]]></category>
      <category><![CDATA[Integrated circuit packages Tenders]]></category>
      <category><![CDATA[Integrated circuit sockets or mounts Tenders]]></category>
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      <link>https://www.biddingsource.com/tenders/9076215</link>
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      <title><![CDATA[Acquisition of electronic cards with contactless integrated circuit (Contactless Smart Card), with 1K and 4K memory, MIFARE ISO/IEC 14443 A/B standard, as requested by the Foztrans Public Transport Division, intended for use in th… - 7834112]]></title>
      <description><![CDATA[Publish Date: 2025/08/28<br/>Closing Date: <br/>Country: Brazil]]></description>
      <pubDate>Wed, 27 Aug 2025 22:39:16 GMT</pubDate>
      <dc:creator>Bidding Source</dc:creator>
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      <link>https://www.biddingsource.com/tenders/9079025</link>
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      <title><![CDATA[Service for manufacturing, storing, printing, personalizing and distributing identification cards on contactless integrated circuit cards - badges - 7836971]]></title>
      <description><![CDATA[Publish Date: 2025/08/28<br/>Closing Date: <br/>Country: Brazil]]></description>
      <pubDate>Wed, 27 Aug 2025 22:54:07 GMT</pubDate>
      <dc:creator>Bidding Source</dc:creator>
      <category><![CDATA[Integrated circuit lids Tenders]]></category>
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      <link>https://www.biddingsource.com/tenders/9079097</link>
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      <title><![CDATA[Southeast University School of Integrated Circuits Process and Device Design Kit - 7837046]]></title>
      <description><![CDATA[Publish Date: 2025/08/28<br/>Closing Date: 2025/09/16<br/>Country: China ]]></description>
      <pubDate>Wed, 27 Aug 2025 22:54:28 GMT</pubDate>
      <dc:creator>Bidding Source</dc:creator>
      <category><![CDATA[Integrated circuit sockets or mounts Tenders]]></category>
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      <link>https://www.biddingsource.com/tenders/9022791</link>
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      <title><![CDATA[Announcement of Competitive Consultation for the Construction of Integrated Circuit Collaborative Research Project of Huazhong University of Science and Technology - 7921252]]></title>
      <description><![CDATA[Publish Date: 2025/08/15<br/>Closing Date: <br/>Country: China ]]></description>
      <pubDate>Thu, 14 Aug 2025 23:36:28 GMT</pubDate>
      <dc:creator>Bidding Source</dc:creator>
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      <link>https://www.biddingsource.com/tenders/8997152</link>
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      <title><![CDATA[EDA Data Center of the School of Integrated Circuit Industry, East China Normal University - 7898024]]></title>
      <description><![CDATA[Publish Date: 2025/08/11<br/>Closing Date: <br/>Country: China ]]></description>
      <pubDate>Sun, 10 Aug 2025 23:12:46 GMT</pubDate>
      <dc:creator>Bidding Source</dc:creator>
      <category><![CDATA[Integrated circuit sockets or mounts Tenders]]></category>
      <category><![CDATA[Electronic integrated circuits and microassemblies Tenders]]></category>
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      <link>https://www.biddingsource.com/tenders/8997673</link>
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      <title><![CDATA[Implementation of integrated circuit cultural display - 7898545]]></title>
      <description><![CDATA[Publish Date: 2025/08/11<br/>Closing Date: <br/>Country: China ]]></description>
      <pubDate>Sun, 10 Aug 2025 23:16:18 GMT</pubDate>
      <dc:creator>Bidding Source</dc:creator>
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      <link>https://www.biddingsource.com/tenders/8999873</link>
      <author>info@biddingsource.com</author>
      <title><![CDATA[Southeast University School of Integrated Circuits 12-inch probe station - 7900744]]></title>
      <description><![CDATA[Publish Date: 2025/08/11<br/>Closing Date: <br/>Country: China ]]></description>
      <pubDate>Sun, 10 Aug 2025 23:27:27 GMT</pubDate>
      <dc:creator>Bidding Source</dc:creator>
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      <category><![CDATA[Electronic integrated circuits and microassemblies Tenders]]></category>
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      <link>https://www.biddingsource.com/tenders/8987761</link>
      <author>info@biddingsource.com</author>
      <title><![CDATA[Southeast University School of Integrated Circuits procurement of scanning electrochemical microscope - 7658086]]></title>
      <description><![CDATA[Publish Date: 2025/08/07<br/>Closing Date: <br/>Country: China ]]></description>
      <pubDate>Thu, 07 Aug 2025 10:58:31 GMT</pubDate>
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      <link>https://www.biddingsource.com/tenders/8975577</link>
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      <title><![CDATA[INTENT TO SOLE SOURCE: One (1) Maple Leaf Photonics PIC (Photonic Integrated Circuits) Probe Station - W911QX25QA094]]></title>
      <description><![CDATA[Publish Date: 2025/08/04<br/>Closing Date: 2025/08/08<br/>Country: United States]]></description>
      <pubDate>Mon, 04 Aug 2025 13:00:58 GMT</pubDate>
      <dc:creator>Bidding Source</dc:creator>
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      <link>https://www.biddingsource.com/tenders/8970555</link>
      <author>info@biddingsource.com</author>
      <title><![CDATA[Southeast University Integrated Circuit College Semiconductor Device Pulse Voltage and Current Test System Procurement Project - 781812]]></title>
      <description><![CDATA[Publish Date: 2025/08/04<br/>Closing Date: 2025/08/22<br/>Country: China ]]></description>
      <pubDate>Mon, 04 Aug 2025 00:06:56 GMT</pubDate>
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      <link>https://www.biddingsource.com/tenders/8953362</link>
      <author>info@biddingsource.com</author>
      <title><![CDATA[Southeast University School of Integrated Circuits Chip Intelligent Computing Full-Stack Design Platform Procurement - 8947756]]></title>
      <description><![CDATA[Publish Date: 2025/07/31<br/>Closing Date: <br/>Country: China ]]></description>
      <pubDate>Wed, 30 Jul 2025 22:53:56 GMT</pubDate>
      <dc:creator>Bidding Source</dc:creator>
      <category><![CDATA[Electronic integrated circuits and microassemblies Tenders]]></category>
      <category><![CDATA[Integrated circuit sockets or mounts Tenders]]></category>
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      <link>https://www.biddingsource.com/tenders/8934718</link>
      <author>info@biddingsource.com</author>
      <title><![CDATA[Southeast University School of Integrated Circuits Process and Device Design Kit - 6760887]]></title>
      <description><![CDATA[Publish Date: 2025/07/28<br/>Closing Date: 2025/08/19<br/>Country: China ]]></description>
      <pubDate>Sun, 27 Jul 2025 23:24:47 GMT</pubDate>
      <dc:creator>Bidding Source</dc:creator>
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      <link>https://www.biddingsource.com/tenders/8885024</link>
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      <title><![CDATA[Southeast University School of Integrated Circuits Ultrasonic Microscope Procurement Project - 7868880]]></title>
      <description><![CDATA[Publish Date: 2025/07/17<br/>Closing Date: 2025/08/05<br/>Country: China ]]></description>
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      <title><![CDATA[Southeast University School of Integrated Circuits Scanning Electrochemical Microscope Purchase - 7868879]]></title>
      <description><![CDATA[Publish Date: 2025/07/17<br/>Closing Date: 2025/08/05<br/>Country: China ]]></description>
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      <title><![CDATA[Southeast University School of Integrated Circuits Fourier Infrared Spectrometer Procurement Project - 7868878]]></title>
      <description><![CDATA[Publish Date: 2025/07/17<br/>Closing Date: 2025/08/05<br/>Country: China ]]></description>
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      <title><![CDATA[Southeast University School of Integrated Circuits 12-inch probe station - 7868877]]></title>
      <description><![CDATA[Publish Date: 2025/07/17<br/>Closing Date: 2025/08/07<br/>Country: China ]]></description>
      <pubDate>Wed, 16 Jul 2025 19:35:34 GMT</pubDate>
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      <title><![CDATA[Southeast University School of Integrated Circuits High and Low Temperature Vacuum Probe Station Procurement Project - 938818]]></title>
      <description><![CDATA[Publish Date: 2025/07/14<br/>Closing Date: 2025/08/01<br/>Country: China ]]></description>
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      <title><![CDATA[Southeast University Integrated Circuit Institute Digital Standard Cell Library Design Verification Tool Procurement Project - 938813]]></title>
      <description><![CDATA[Publish Date: 2025/07/14<br/>Closing Date: 2025/08/01<br/>Country: China ]]></description>
      <pubDate>Sun, 13 Jul 2025 23:03:52 GMT</pubDate>
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      <title><![CDATA[Southeast University School of Integrated Circuits Procurement of Constant Temperature Air Pressure Box - 888702]]></title>
      <description><![CDATA[Publish Date: 2025/07/07<br/>Closing Date: <br/>Country: China ]]></description>
      <pubDate>Sun, 06 Jul 2025 21:54:16 GMT</pubDate>
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      <title><![CDATA[Southeast University School of Integrated Circuits High Resolution Optical Link Diagnostic Instrument OCI Purchase - 792587]]></title>
      <description><![CDATA[Publish Date: 2025/07/03<br/>Closing Date: <br/>Country: China ]]></description>
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      <title><![CDATA[4H-SiC Silicon Carbide (SiC) Integrated Circuit Processing on 100 mm Diameter SiC Wafers - 80GRC025R7016_RFP]]></title>
      <description><![CDATA[Publish Date: 2025/07/01<br/>Closing Date: 2025/07/28<br/>Country: United States]]></description>
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      <title><![CDATA[Renovation project of some rooms in the School of Integrated Circuits, 2nd to 5th floors, Building JA12, Jiangjun Road Campus, Nanjing University of Aeronautics and Astronautics - 9472111]]></title>
      <description><![CDATA[Publish Date: 2025/07/01<br/>Closing Date: <br/>Country: China ]]></description>
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      <title><![CDATA[Vacuum isolation window mirror and fixing parts of School of Integrated Circuit Science and Engineering, Beihang University - 846738]]></title>
      <description><![CDATA[Publish Date: 2025/06/10<br/>Closing Date: 2025/06/27<br/>Country: China ]]></description>
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      <title><![CDATA[Vacuum Cooling Background Precision Optomechanical Components, School of Integrated Circuit Science and Engineering, Beihang University - 846737]]></title>
      <description><![CDATA[Publish Date: 2025/06/10<br/>Closing Date: 2025/06/27<br/>Country: China ]]></description>
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      <title><![CDATA[Southeast University School of Integrated Circuits Memory Yield Analysis Software Purchase - 846319]]></title>
      <description><![CDATA[Publish Date: 2025/06/10<br/>Closing Date: <br/>Country: China ]]></description>
      <pubDate>Mon, 09 Jun 2025 23:04:49 GMT</pubDate>
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      <title><![CDATA[Renovation project of some rooms in the School of Integrated Circuits, 2nd to 5th floors, Building JA12, Jiangjun Road Campus, Nanjing University of Aeronautics and Astronautics - 846114]]></title>
      <description><![CDATA[Publish Date: 2025/06/10<br/>Closing Date: 2025/06/27<br/>Country: China ]]></description>
      <pubDate>Mon, 09 Jun 2025 23:03:49 GMT</pubDate>
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      <link>https://www.biddingsource.com/tenders/8730839</link>
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      <title><![CDATA[Southeast University School of Integrated Circuits Procurement of Constant Temperature Air Pressure Box - 13573]]></title>
      <description><![CDATA[Publish Date: 2025/06/06<br/>Closing Date: 2025/07/04<br/>Country: China ]]></description>
      <pubDate>Fri, 06 Jun 2025 00:02:26 GMT</pubDate>
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      <link>https://www.biddingsource.com/tenders/8710280</link>
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      <title><![CDATA[Southeast University Integrated Circuit Institute GPU High-Performance Server Unit Procurement Project - 07324]]></title>
      <description><![CDATA[Publish Date: 2025/06/03<br/>Closing Date: 2025/06/20<br/>Country: China ]]></description>
      <pubDate>Mon, 02 Jun 2025 22:38:49 GMT</pubDate>
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      <title><![CDATA[Integrated Circuit Formal Verification Software Procurement Project of Institute of Computing Technology, Chinese Academy of Sciences - 05512]]></title>
      <description><![CDATA[Publish Date: 2025/06/03<br/>Closing Date: <br/>Country: China ]]></description>
      <pubDate>Mon, 02 Jun 2025 22:24:50 GMT</pubDate>
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      <title><![CDATA[28nm integrated circuit MPW tape-out service - 09028]]></title>
      <description><![CDATA[Publish Date: 2025/05/30<br/>Closing Date: <br/>Country: China ]]></description>
      <pubDate>Thu, 29 May 2025 21:57:08 GMT</pubDate>
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      <title><![CDATA[Field Programmable Gate Array Integrated Circuit Device 25 Pieces - 11670]]></title>
      <description><![CDATA[Publish Date: 2025/04/15<br/>Closing Date: <br/>Country: Japan]]></description>
      <pubDate>Mon, 14 Apr 2025 23:15:56 GMT</pubDate>
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      <title><![CDATA[Supply of a card for storing and processing personal data with embedded integrated circuits - 11676]]></title>
      <description><![CDATA[Publish Date: 2025/04/07<br/>Closing Date: 2025/04/11<br/>Country: Russia]]></description>
      <pubDate>Sun, 06 Apr 2025 22:16:14 GMT</pubDate>
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      <title><![CDATA[Supply of postal-savings integrated circuit cards, issue management - 09447]]></title>
      <description><![CDATA[Publish Date: 2025/03/11<br/>Closing Date: <br/>Country: Japan]]></description>
      <pubDate>Tue, 11 Mar 2025 13:35:08 GMT</pubDate>
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      <title><![CDATA[Supply of cards with built-in integrated circuits (smart cards) for the Roller analyzer (Narcology) - 08735]]></title>
      <description><![CDATA[Publish Date: 2025/03/11<br/>Closing Date: 2025/03/17<br/>Country: Russia]]></description>
      <pubDate>Tue, 11 Mar 2025 13:31:50 GMT</pubDate>
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      <title><![CDATA[Delivery of a set of measurement and design devices for characterization and design of photonic integrated circuits - 62742]]></title>
      <description><![CDATA[Publish Date: 2025/02/03<br/>Closing Date: 2025/02/28<br/>Country: Poland]]></description>
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      <title><![CDATA[Provision of Services for Training in Integrated Circuit Des - Please see eligibility criteria - IGNITE/ICDV/2024-25/0012/Proc - 04314]]></title>
      <description><![CDATA[Publish Date: 2025/01/20<br/>Closing Date: 2025/02/07<br/>Country: Pakistan]]></description>
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      <title><![CDATA[PURCHASE AND DELIVERY OF TELEDYNE ANALOGUE TO DIGITAL CONVERTER (ADC) INTEGRATED CIRCUITS - 02961]]></title>
      <description><![CDATA[Publish Date: 2024/12/17<br/>Closing Date: 2025/01/31<br/>Country: South Africa]]></description>
      <pubDate>Tue, 17 Dec 2024 16:08:35 GMT</pubDate>
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      <title><![CDATA[PURCHASE AND DELIVERY OF ADVANCED MICRO DEVICES (AMD) FIELD PROGRAMMABLE GATE ARRAY (FPGA) INTEGRATED CIRCUITS - 02960]]></title>
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      <title><![CDATA[Linear Integrated Circuit_PA202402074 - 08602]]></title>
      <description><![CDATA[Publish Date: 2024/12/08<br/>Closing Date: <br/>Country: Korea, South]]></description>
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      <title><![CDATA[R&D project “Development and production of helium-neon lasers and photodetectors for equipment positioning systems used in the production of integrated circuits with topological standards up… - 11418]]></title>
      <description><![CDATA[Publish Date: 2024/11/26<br/>Closing Date: 2024/12/09<br/>Country: Russia]]></description>
      <pubDate>Mon, 25 Nov 2024 23:54:06 GMT</pubDate>
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      <title><![CDATA[Huazhong University of Science and Technology purchases integrated integrated circuit ATE test system project - 14636]]></title>
      <description><![CDATA[Publish Date: 2024/11/26<br/>Closing Date: <br/>Country: China ]]></description>
      <pubDate>Mon, 25 Nov 2024 23:37:52 GMT</pubDate>
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      <title><![CDATA[Tianshui Huatian Technology Co., Ltd. Integrated Circuit High Reliability Packaging and Testing Expansion Project Phase 4 Tender Announcement]]></title>
      <description><![CDATA[Publish Date: 2024/05/13<br/>Closing Date: <br/>Country: China ]]></description>
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      <title><![CDATA[Integrated Circuit - SLAC_345610_IntegratedCircuit]]></title>
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      <description><![CDATA[Publish Date: 2024/04/15<br/>Closing Date: 2024/04/19<br/>Country: Russia]]></description>
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      <title><![CDATA[Tianshui Huatian Technology Co., Ltd. "Integrated Circuit High Reliability Packaging and Testing Expansion " Phase 3 Bidding Announcement]]></title>
      <description><![CDATA[Publish Date: 2024/03/07<br/>Closing Date: <br/>Country: China ]]></description>
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