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Awarded - Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P - 8992994

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This tender with title Awarded - Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P - 8992994 has been published on Bidding Source portal dated 16 Oct 2026 for the country of Germany. It has been categorized on Miscellaneous special-purpose machinery. For similar tenders you can see tenders mentioned below of this page.

General Information

Awarded - Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P - 8992994
Contract Award
8992994
Germany
16 Oct 2026
English
Miscellaneous special-purpose machinery

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