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Harbin Institute of Technology 2.5D/3D Advanced Packaging Chip Design Software System Procurement Project Postponement Notice - 8437430

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This tender with title Harbin Institute of Technology 2.5D/3D Advanced Packaging Chip Design Software System Procurement Project Postponement Notice - 8437430 has been published on Bidding Source portal dated 23 Oct 2026 for the country of China . It has been categorized on Educational software package. For similar tenders you can see tenders mentioned below of this page.

General Information

China

Harbin Institute of Technology 2.5D/3D Advanced Packaging Chip Design Software System Procurement Project Postponement Notice - 8437430
Invitation for Bids
8437430
China
23 Oct 2026
Chinese
Educational software package

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