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Harbin Institute of Technology 2.5D/3D Advanced Packaging Chip Design Software System Procurement Project Postponement Notice - 5097866

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This tender with title Harbin Institute of Technology 2.5D/3D Advanced Packaging Chip Design Software System Procurement Project Postponement Notice - 5097866 has been published on Bidding Source portal dated 26 Oct 2026 for the country of China . It has been categorized on Computer-aided design (CAD) system. For similar tenders you can see tenders mentioned below of this page.

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China

Harbin Institute of Technology 2.5D/3D Advanced Packaging Chip Design Software System Procurement Project Postponement Notice - 5097866
Invitation for Bids
5097866
China
26 Oct 2026
Chinese
Computer-aided design (CAD) system

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