This tender with title Automated 300 mm Die-to-Wafer thermocompression bonding tool - PR1275392-3460-W - 2012350 has been published on Bidding Source portal dated 04 Nov 2026 for the country of Germany. It has been categorized on Microelectronic machinery and apparatus and microsystems. For similar tenders you can see tenders mentioned below of this page.
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