Public Tender Announcement for the Procurement of a Silicon Wafer Laser Slicing and Dividing System and White Light Interferometry System at Beijing Institute of Technology - 2013684

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This tender with title Public Tender Announcement for the Procurement of a Silicon Wafer Laser Slicing and Dividing System and White Light Interferometry System at Beijing Institute of Technology - 2013684 has been published on Bidding Source portal dated 04 Nov 2026 for the country of China . It has been categorized on Detection and analysis apparatus. For similar tenders you can see tenders mentioned below of this page.

General Information

China

Tender Title :

Public Tender Announcement for the Procurement of a Silicon Wafer Laser Slicing and Dividing System and White Light Interferometry System at Beijing Institute of Technology - 2013684

Tender Type :

Invitation for Bids

Reference No. :

2013684

Country :

China

Publish Date :

4 Nov 2026

Notice Language :

Chinese

Tender Categories (CPVs) :

Detection and analysis apparatus

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Public Tender Announcement for the Procurement of a Silicon Wafer Laser Slicing and Dividing System and White Light Interferometry System at Beijing Institute of Technology - 2013684

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China

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