loader

World Tenders & Procurement Opportunities

Search
Advanced Search

Czech Republic-Liberec: Microelectronic machinery and apparatus

World Biggest Tenders Source

This tender with title Czech Republic-Liberec: Microelectronic machinery and apparatus has been published on Bidding Source portal dated 29 Jul 2018 for the country of Czech Republic. It has been categorized on Microelectronic machinery and apparatus. For similar tenders you can see tenders mentioned below of this page.

General Information

Czech Republic

Czech Republic-Liberec: Microelectronic machinery and apparatus
Contract Award
2018/S 140-320368
Czech Republic
Czech Republic-Liberec
29 Jul 2018
English
Microelectronic machinery and apparatus

For viewing full details of tenders, you should Log in to your account. If not registered yet, Please Register Now

Or Request a call back now and one of our representatives will contact you. Contact us

Similar Tenders

RÁMCOVÁ DOHODA NA DODÁVKY DOBÍJECÍCH STANIC STEJNOSMĚRNÉHO DOBÍJENÍ -- Microelectronic machinery and apparatus Czech Republic Czech Republic-Liberec: Microelectronic machinery and apparatus Czech Republic Czech Republic-Liberec: Microelectronic machinery and apparatus Czech Republic Czech Republic-Liberec: Microelectronic machinery and apparatus Czech Republic 321320- France – Microelectronic machinery and apparatus – Supply of a large-format growth oven for II-VI die France 304208-Awarded - Spain – Microelectronic machinery and apparatus – Supply, installation and commissioning of an ICP-RIE (Inductively Coupled Plasma - Reactive Ion Etching) system for dry plasma etching of various materials for the Institute of Micro and Nanotechnology of the State Agency Consejo Superior de Investigaciones Científicas. -- <b>Contract Value: 30 800,00 EUR </b> Spain Microelectronics Innovation for Next-generation System Advancement and Validation (MINSAV) Advanced Research Announcement (ARA) with Calls - FA8650-19-S-1932 -- AC12 - NATIONAL DEFENSE R&D SERVICES; DEPARTMENT OF DEFENSE - MILITARY; APPLIED RESEARCH United States 231671- Germany – Microelectronic machinery and apparatus – High Precision bonder for wafer and chiplet level assembly (IZM-01 - PR915599-2590-P Germany 229196-Awarded - France – Microelectronic machinery and apparatus – Acquisition d'un four de recuit thermique (RTA) -- <b>Contract Value: 149 705,10 EUR</b> France 229807-Awarded - Germany – Microelectronic machinery and apparatus – Waferbonder (IZM-31 - PR915379-2590-P Germany
Microelectronic machinery and apparatus Tenders
Czech Republic Tenders
Europe Tenders
Tenders
No. 12, 1 st floor, Block B2, EGS Business Park, World Trade Center, Bakirkoy - Istanbul - Turkey
info@biddingsource.com
24 X 7 online support
TOP
For viewing latest tenders published for your business in all over the World: Sign in Join free
For accessing full details of Tenders, Kindly choose the Plan that works for you: View Subscription Plans