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Inductively-coupled Plasma Reactive-ion Etching (ICP-RIE) Device

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This tender with title Inductively-coupled Plasma Reactive-ion Etching (ICP-RIE) Device -- Dry-etching equipment has been published on Bidding Source portal dated 15 May 2020 for the country of Finland. It has been categorized on Dry-etching equipment. For similar tenders you can see tenders mentioned below of this page.

Dry-etching equipment

General Information

Inductively-coupled Plasma Reactive-ion Etching (ICP-RIE) Device
Dry-etching equipment
Invitation for Bids
2020/S 093-221701
Finland
Finland-Aalto
15 May 2020
11 Jun 2020
English
Dry-etching equipment

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