Tender provision of one unit of fine pitch-2963663

This tender with title Provision of One Unit of Fine Pitch Hybrid Bonder and/or One Unit of Wafer Level Temporary Adhesive Bonding Tool has been published on Bidding Source portal dated 02 Apr 2021 for the country of Singapore. It has been categorized on Adhesives. For similar tenders you can see tenders mentioned below of this page.

General Information

Singapore

Tender Title :

Provision of One Unit of Fine Pitch Hybrid Bonder and/or One Unit of Wafer Level Temporary Adhesive Bonding Tool

Tender Type :

Invitation for Bids

Country :

Singapore

Publish Date :

2 Apr 2021

Closing Date :

26 Apr 2021

Notice Language :

English

Tender Categories (CPVs) :

Adhesives

Full Tender Details :

For viewing full details of tenders, you should Log in to your account. If not registered yet, Please Register Now

Or Request a call back now and one of our representatives will contact you. Contact us

Similar Tenders

INVITATION TO QUOTE FOR THE SUPPLY AND DELIVERY OF A4-SIZED MAGNETIC SHEETS WITH ADHESIVE FOR PUNGGOL REGIONAL LIBRARY Singapore Singapore - SUPPLY AND DELIVERY OF SELF-ADHESIVE BANDAGES Singapore Supply of Chemicals, Adhesive and Sealants Singapore Supply of Chemicals, Adhesive and Sealants Singapore Supply of Chemicals, Adhesive and Sealants Singapore Supply of Chemicals, Adhesive and Sealants Singapore Supply of Chemicals, Adhesive and Sealants Singapore Supply of Chemicals, Adhesive and Sealants Singapore Supply of Chemicals, Adhesive and Sealants Singapore Chemicals, Adhesive and Sealants supply Singapore

Provision of One Unit of Fine Pitch Hybrid Bonder and/or One Unit of Wafer Level Temporary Adhesive Bonding Tool

General Information

Singapore

Similar Tenders

Adhesives Tenders

Singapore Tenders

Asia Tenders

Tenders

info@biddingsource.com