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天水华天科技股份有限公司 《微控制单元（MCU）芯片封装产业升级项目》第一期招标公告

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This tender with title 天水华天科技股份有限公司 《微控制单元（MCU）芯片封装产业升级项目》第一期招标公告 -- Tianshui Huatian Technology Co., Ltd. "Micro Control Unit (MCU) Chip Packaging Industry Upgrade Project" Phase I Tender Announcement has been published on Bidding Source portal dated 09 Mar 2022 for the country of China . It has been categorized on Industrial process control equipment and remote-control equipment. For similar tenders you can see tenders mentioned below of this page.

Tianshui Huatian Technology Co., Ltd. "Micro Control Unit (MCU) Chip Packaging Industry Upgrade Project" Phase I Tender Announcement

General Information

China

天水华天科技股份有限公司 《微控制单元（MCU）芯片封装产业升级项目》第一期招标公告
Tianshui Huatian Technology Co., Ltd. "Micro Control Unit (MCU) Chip Packaging Industry Upgrade Project" Phase I Tender Announcement
Invitation for Bids
China
9 Mar 2022
Chinese
Industrial process control equipment and remote-control equipment

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