Japan - A High-resolution in situ spatial genomics analysis system 1 Set,Ｂ Wafer-level Direct Bonding System 1 Set,Ｃ Contact Layer Direct lithography System 1 Set,Ｄ Dual-Plane Mesoscopic Two-Photon Microscope 1 Set,Ｅ 3D Micro-fabrication System

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This tender with title Japan - A High-resolution in situ spatial genomics analysis system 1 Set,Ｂ Wafer-level Direct Bonding System 1 Set,Ｃ Contact Layer Direct lithography System 1 Set,Ｄ Dual-Plane Mesoscopic Two-Photon Microscope 1 Set,Ｅ 3D Micro-fabrication System has been published on Bidding Source portal dated 05 Apr 2023 for the country of Japan. It has been categorized on Detection and analysis apparatus & Analysis apparatus. For similar tenders you can see tenders mentioned below of this page.

General Information

Japan

Tender Title :

Japan - A High-resolution in situ spatial genomics analysis system 1 Set,Ｂ Wafer-level Direct Bonding System 1 Set,Ｃ Contact Layer Direct lithography System 1 Set,Ｄ Dual-Plane Mesoscopic Two-Photon Microscope 1 Set,Ｅ 3D Micro-fabrication System

Tender Type :

Invitation to Tender

Country :

Japan

Publish Date :

5 Apr 2023

Notice Language :

English

Tender Categories (CPVs) :

Detection and analysis apparatus , Analysis apparatus

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Japan - A High-resolution in situ spatial genomics analysis system 1 Set,Ｂ Wafer-level Direct Bonding System 1 Set,Ｃ Contact Layer Direct lithography System 1 Set,Ｄ Dual-Plane Mesoscopic Two-Photon Microscope 1 Set,Ｅ 3D Micro-fabrication System

General Information

Japan

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