University of Electronic Science and Technology of China Integrated Circuit Analysis and Testing System Procurement

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This tender with title University of Electronic Science and Technology of China Integrated Circuit Analysis and Testing System Procurement has been published on Bidding Source portal dated 20 Jun 2023 for the country of China . It has been categorized on Electronic integrated circuits and microassemblies & Integrated circuit lids & Integrated circuit packages & Integrated circuit sockets or mounts & Electronic equipment. For similar tenders you can see tenders mentioned below of this page.

General Information

China

Tender Title :

University of Electronic Science and Technology of China Integrated Circuit Analysis and Testing System Procurement

Tender Type :

Invitation to Tender

Country :

China

Province/City :

四川省

Publish Date :

20 Jun 2023

Notice Language :

Chinese

Tender Categories (CPVs) :

Electronic integrated circuits and microassemblies , Integrated circuit lids , Integrated circuit packages , Integrated circuit sockets or mounts , Electronic equipment

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University of Electronic Science and Technology of China Integrated Circuit Analysis and Testing System Procurement

General Information

China

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