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Système/Equipement de collage et intégration de puce sur wafer pour le Centre de micro-nanotechnologie

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This tender with title Système/Equipement de collage et intégration de puce sur wafer pour le Centre de micro-nanotechnologie --

System/Equipment for bonding and integrating chip on wafer for the Micro-Nanotechnology Center
has been published on Bidding Source portal dated 14 Aug 2023 for the country of Switzerland. It has been categorized on Laboratory, optical and precision equipments (excl. glasses). For similar tenders you can see tenders mentioned below of this page.

System/Equipment for bonding and integrating chip on wafer for the Micro-Nanotechnology Center

General Information

Système/Equipement de collage et intégration de puce sur wafer pour le Centre de micro-nanotechnologie
System/Equipment for bonding and integrating chip on wafer for the Micro-Nanotechnology Center
Invitation for Bids
2023/S 152-485988
Switzerland
Switzerland-Lausanne
14 Aug 2023
13 Sep 2023
English
Laboratory, optical and precision equipments (excl. glasses)

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