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金川集团半导体封装新材料（兰州）生产线建设项目（一期） PC(采购施工)总承包--二次机电工程专业分包 招标公告

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This tender with title 金川集团半导体封装新材料（兰州）生产线建设项目（一期） PC(采购施工)总承包--二次机电工程专业分包 招标公告 --

Jinchuan Group Semiconductor Packaging New Materials (Lanzhou) Production Line Construction (Phase I) PC (Procurement and Construction) General Contra…
has been published on Bidding Source portal dated 21 Aug 2023 for the country of China . It has been categorized on Semiconductors & Construction materials. For similar tenders you can see tenders mentioned below of this page.

Jinchuan Group Semiconductor Packaging New Materials (Lanzhou) Production Line Construction (Phase I) PC (Procurement and Construction) General Contra…

General Information

China

金川集团半导体封装新材料（兰州）生产线建设项目（一期） PC(采购施工)总承包--二次机电工程专业分包 招标公告
Jinchuan Group Semiconductor Packaging New Materials (Lanzhou) Production Line Construction (Phase I) PC (Procurement and Construction) General Contra…
Invitation for Bids
China
21 Aug 2023
Chinese
Semiconductors , Construction materials

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