China - Sub-micron flip-chip welding machine procurement of Institute of Semiconductors, Chinese Academy of Sciences

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This tender with title China - Sub-micron flip-chip welding machine procurement of Institute of Semiconductors, Chinese Academy of Sciences has been published on Bidding Source portal dated 07 Sep 2023 for the country of China . It has been categorized on Non-electric welding equipment & Electric welding equipment & Welding equipment & Semiconductors. For similar tenders you can see tenders mentioned below of this page.

General Information

China

Tender Title :

China - Sub-micron flip-chip welding machine procurement of Institute of Semiconductors, Chinese Academy of Sciences

Tender Type :

Invitation to Tender

Country :

China

Province/City :

北京市

Publish Date :

7 Sep 2023

Notice Language :

Chinese

Tender Categories (CPVs) :

Non-electric welding equipment , Electric welding equipment , Welding equipment , Semiconductors

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China - Sub-micron flip-chip welding machine procurement of Institute of Semiconductors, Chinese Academy of Sciences

General Information

China

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