Procurement Project of High-Precision Chip Placement and Wire Coupling System by Institute of Semiconductors, Chinese Academy of Sciences - 4203808

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This tender with title Procurement Project of High-Precision Chip Placement and Wire Coupling System by Institute of Semiconductors, Chinese Academy of Sciences - 4203808 has been published on Bidding Source portal dated 04 Dec 2025 for the country of China . It has been categorized on Wire & Couplings & Semiconductors & Cable, wire and related products. For similar tenders you can see tenders mentioned below of this page.

General Information

China

Tender Title :

Procurement Project of High-Precision Chip Placement and Wire Coupling System by Institute of Semiconductors, Chinese Academy of Sciences - 4203808

Tender Type :

Invitation to Tender

Reference No. :

4203808

Country :

China

Province/City :

北京市

Publish Date :

4 Dec 2025

Closing Date :

23 Dec 2025

Notice Language :

Chinese

Tender Categories (CPVs) :

Wire , Couplings , Semiconductors , Cable, wire and related products

Full Tender Details :

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Procurement Project of High-Precision Chip Placement and Wire Coupling System by Institute of Semiconductors, Chinese Academy of Sciences - 4203808

General Information

China

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