This tender with title TPO-REQ-2025-008266-SH-Invitation to Quote for Three-Year Subscription of Semiconductor Simulation and Integrated Circuit Design Software License - 9022735 has been published on Bidding Source portal dated 22 Dec 2025 for the country of Singapore. It has been categorized on Integrated circuit packages & Integrated circuit sockets or mounts & Electronic integrated circuits and microassemblies & Pattern design software package & Pattern design software development services & Software package and information systems & Integrated circuit lids. For similar tenders you can see tenders mentioned below of this page.
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