853504-Awarded - France – Microelectronic machinery and apparatus – Acquisition of a component assembly system using the flip-chip method (flip-chip bonder)

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This tender with title 853504-Awarded - France – Microelectronic machinery and apparatus – Acquisition of a component assembly system using the flip-chip method (flip-chip bonder) -- Contract Value: 394 200,00 EUR has been published on Bidding Source portal dated 25 Dec 2025 for the country of France. It has been categorized on Microelectronic machinery and apparatus. For similar tenders you can see tenders mentioned below of this page.

Contract Value: 394 200,00 EUR

General Information

France

Tender Title :

853504-Awarded - France – Microelectronic machinery and apparatus – Acquisition of a component assembly system using the flip-chip method (flip-chip bonder)
Contract Value: 394 200,00 EUR

Tender Type :

Contract Award

Reference No. :

853504

Country :

France

Publish Date :

25 Dec 2025

Notice Language :

English

Tender Categories (CPVs) :

Microelectronic machinery and apparatus

Full Tender Details :

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853504-Awarded - France – Microelectronic machinery and apparatus – Acquisition of a component assembly system using the flip-chip method (flip-chip bonder)

Contract Value: 394 200,00 EUR

General Information

France

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