Fudan University Active Silicon Interposer Chip Modification and Design Service - 2004963

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This tender with title Fudan University Active Silicon Interposer Chip Modification and Design Service - 2004963 has been published on Bidding Source portal dated 03 Feb 2026 for the country of China . It has been categorized on . For similar tenders you can see tenders mentioned below of this page.

General Information

China

Tender Title :

Fudan University Active Silicon Interposer Chip Modification and Design Service - 2004963

Tender Type :

Invitation to Tender

Reference No. :

2004963

Country :

China

Province/City :

上海市

Publish Date :

3 Feb 2026

Notice Language :

Chinese

Full Tender Details :

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Fudan University Active Silicon Interposer Chip Modification and Design Service - 2004963

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China

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