Microelectronic machinery and microsystems tenders , Page 149

List of Tenders

Total: 4866

Acquisition of scientific equipment for laboratories and clean rooms for the benefit of the Microelectronics and Nanotechnology Research Center of Sousse.

Publish Date: 30 Jan 2024

Closing Date: 6 Mar 2024

Country: Tunisia

Tender Type: Invitation to Bids

Language: French

WS3775455122 - 31034-233311_B - Printed Circuit Board Assemblies

Publish Date: 30 Jan 2024

Closing Date: 14 Feb 2024

Country: Canada

Tender Type: RFP - Request for Proposal (Formal)

Language: English

Automatic switch off to circuit board - 11502535-1

Publish Date: 30 Jan 2024

Closing Date: 5 Feb 2024

Country: Kazakhstan

Tender Type: Invitation for Bids

Language: Russian

Integrated circuit positioning and sample preparation system procurement of the Fifth Research Institute of Electronics of the Ministry of Industry and Information Technology

Publish Date: 30 Jan 2024

Closing Date:

Country: China

Tender Type: Invitation to Tender

Language: Chinese

62--LAMP,LIGHT EMITTING - SPE8E724T1460

Publish Date: 25 Jan 2024

Closing Date: 5 Feb 2024

Country: United States

Tender Type: Invitation for Bids

Language: English

12-inch wafer cleaning machine procurement of Institute of Microelectronics, Chinese Academy of Sciences

Publish Date: 25 Jan 2024

Closing Date:

Country: China

Tender Type: Invitation to Tender

Language: Chinese

12-inch wafer bonding annealing furnace procurement of Institute of Microelectronics, Chinese Academy of Sciences

Publish Date: 25 Jan 2024

Closing Date:

Country: China

Tender Type: Invitation to Tender

Language: Chinese

Southeast University Science Platform Semiconductor Clean Integrated Environment System Procurement

Publish Date: 25 Jan 2024

Closing Date:

Country: China

Tender Type: Invitation to Tender

Language: Chinese

Acquisition and installation of photovoltaic equipment for 40 sectors in Kinshasa and REGIDESO central computer center

Publish Date: 23 Jan 2024

Closing Date: 26 Feb 2024

Country: Congo, DR

Tender Type: Invitation for Bids

Language: French

Next-Generation Microelectronics Manufacturing (NGMM) Phase 1 and Phase 2 - DARPA-PA-24-03

Publish Date: 22 Jan 2024

Closing Date: 5 Mar 2024

Country: United States

Tender Type: Invitation for Prequalification

Language: English

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