Integrated Circuit Chip Tape-out and Verification at Southeast University (CMOS 65nm MPW Integrated Circuit Chip Tape-out and Testing Verification, School of Integrated Circuits) - 3004456

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This tender with title Integrated Circuit Chip Tape-out and Verification at Southeast University (CMOS 65nm MPW Integrated Circuit Chip Tape-out and Testing Verification, School of Integrated Circuits) - 3004456 has been published on Bidding Source portal dated 27 Feb 2026 for the country of China . It has been categorized on Integrated circuit packages & Integrated circuit sockets or mounts & Electronic integrated circuits and microassemblies & Integrated circuit lids. For similar tenders you can see tenders mentioned below of this page.

General Information

China

Tender Title :

Integrated Circuit Chip Tape-out and Verification at Southeast University (CMOS 65nm MPW Integrated Circuit Chip Tape-out and Testing Verification, School of Integrated Circuits) - 3004456

Tender Type :

Invitation to Tender

Reference No. :

3004456

Country :

China

Province/City :

江苏省

Publish Date :

27 Feb 2026

Notice Language :

Chinese

Tender Categories (CPVs) :

Integrated circuit packages , Integrated circuit sockets or mounts , Electronic integrated circuits and microassemblies , Integrated circuit lids

Full Tender Details :

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Integrated Circuit Chip Tape-out and Verification at Southeast University (CMOS 65nm MPW Integrated Circuit Chip Tape-out and Testing Verification, School of Integrated Circuits) - 3004456

General Information

China

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