Procurement Project for Integrated Circuit Packaging, Screening and Testing Services by the Institute of Microelectronics, Chinese Academy of Sciences - 2003457

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This tender with title Procurement Project for Integrated Circuit Packaging, Screening and Testing Services by the Institute of Microelectronics, Chinese Academy of Sciences - 2003457 has been published on Bidding Source portal dated 25 Jan 2026 for the country of China . It has been categorized on Microelectronic machinery and apparatus & Electronic integrated circuits and microassemblies & Integrated circuit lids & Integrated circuit packages & Integrated circuit sockets or mounts. For similar tenders you can see tenders mentioned below of this page.

General Information

China

Tender Title :

Procurement Project for Integrated Circuit Packaging, Screening and Testing Services by the Institute of Microelectronics, Chinese Academy of Sciences - 2003457

Tender Type :

Invitation to Tender

Reference No. :

2003457

Country :

China

Province/City :

北京市

Publish Date :

25 Jan 2026

Notice Language :

Chinese

Tender Categories (CPVs) :

Microelectronic machinery and apparatus , Electronic integrated circuits and microassemblies , Integrated circuit lids , Integrated circuit packages , Integrated circuit sockets or mounts

Full Tender Details :

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Procurement Project for Integrated Circuit Packaging, Screening and Testing Services by the Institute of Microelectronics, Chinese Academy of Sciences - 2003457

General Information

China

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