Tender alr-67(v)3 multi-channel-10265140

This tender with title ALR-67(V)3 Multi-Channel Analog-to-Digital (MCAD) Application Specific Integrated Circuit (ASIC) - 5127614 has been published on Bidding Source portal dated 21 Jul 2026 for the country of United States. It has been categorized on Integrated circuit sockets or mounts & Electronic integrated circuits and microassemblies & Integrated circuit lids & Integrated circuit packages. For similar tenders you can see tenders mentioned below of this page.

General Information

United States

Tender Title :

ALR-67(V)3 Multi-Channel Analog-to-Digital (MCAD) Application Specific Integrated Circuit (ASIC) - 5127614

Tender Type :

Invitation for Bids

Reference No. :

5127614

Country :

United States

Publish Date :

21 Jul 2026

Closing Date :

1 Aug 2026

Notice Language :

English

Tender Categories (CPVs) :

Integrated circuit sockets or mounts , Electronic integrated circuits and microassemblies , Integrated circuit lids , Integrated circuit packages

Full Tender Details :

For viewing full details of tenders, you should Log in to your account. If not registered yet, Please Register Now

Or Request a call back now and one of our representatives will contact you. Contact us

Similar Tenders

ALR-67(V)3 Multi-Channel Analog-to-Digital (MCAD) Application Specific Integrated Circuit (ASIC) - N00019-25-RFPREQ-TPM265-0465 United States Procurement is for the project FALCON-Lidar and is for various integrated circuits from AMD Xilinx for the PMT Detector System electronic builds. - 72159197 -- 5999 - MISCELLANEOUS ELECTRICAL AND ELECTRONIC COMPONENTS United States Photonic Integrated Circuit Architectures for Scalable System Objectives (PICASSO) - DARPA-PS-26-13 -- AC12 - NATIONAL DEFENSE R&D SERVICES; DEPARTMENT OF DEFENSE - MILITARY; APPLIED RESEARCH United States Photonic Integrated Circuit Architectures for Scalable System Objectives (PICASSO) - DARPA-PS-26-13 -- AC12 - NATIONAL DEFENSE R&D SERVICES; DEPARTMENT OF DEFENSE - MILITARY; APPLIED RESEARCH United States Photonic Integrated Circuit Architectures for Scalable System Objectives (PICASSO) - DARPA-PS-26-13 -- AC12 - NATIONAL DEFENSE R&D SERVICES; DEPARTMENT OF DEFENSE - MILITARY; APPLIED RESEARCH United States INTENT TO SOLE SOURCE: One (1) Maple Leaf Photonics PIC (Photonic Integrated Circuits) Probe Station - W911QX25QA094 -- 6640 - LABORATORY EQUIPMENT AND SUPPLIES United States 4H-SiC Silicon Carbide (SiC) Integrated Circuit Processing on 100 mm Diameter SiC Wafers - 80GRC025R7016_RFP -- AR11 - SPACE R&D SERVICES; SPACE FLIGHT, RESEARCH AND SUPPORTING ACTIVITIES; BASIC RESEARCH United States Integrated Circuit - SLAC_345610_IntegratedCircuit -- AJ12 - General Science and Technology R&D Services; General science and technology; Applied Research United States Photonic-Integrated Circuit (PIC) Component Fabrication for AstroPIC High-Contrast Imaging Request for Information (RFI) - ASTROPIC-RFI-2024 -- Product Service Code: United States F-15 Very High-Speed Integrated Circuit Central Computers - FA8538-24-R-0002_Solicitation -- 1270 - AIRCRAFT GUNNERY FIRE CONTROL COMPONENTS United States

ALR-67(V)3 Multi-Channel Analog-to-Digital (MCAD) Application Specific Integrated Circuit (ASIC) - 5127614

General Information

United States

Similar Tenders

Integrated circuit sockets or mounts Tenders

Electronic integrated circuits and microassemblies Tenders

Integrated circuit lids Tenders

Integrated circuit packages Tenders

United States Tenders

North America Tenders

Tenders

info@biddingsource.com