This tender with title 4H-SiC Silicon Carbide (SiC) Integrated Circuit Processing on 100 mm Diameter SiC Wafers - 80GRC025R7016_RFP -- AR11 - SPACE R&D SERVICES; SPACE FLIGHT, RESEARCH AND SUPPORTING ACTIVITIES; BASIC RESEARCH has been published on Bidding Source portal dated 01 Jul 2025 for the country of United States. It has been categorized on Integrated circuit sockets or mounts & Integrated circuit lids & Electronic integrated circuits and microassemblies & Integrated circuit packages. For similar tenders you can see tenders mentioned below of this page.
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