Tender 4h-sic silicon carbide (sic) integrated-8811661

This tender with title 4H-SiC Silicon Carbide (SiC) Integrated Circuit Processing on 100 mm Diameter SiC Wafers - 80GRC025R7016_RFP -- AR11 - SPACE R&D SERVICES; SPACE FLIGHT, RESEARCH AND SUPPORTING ACTIVITIES; BASIC RESEARCH has been published on Bidding Source portal dated 01 Jul 2025 for the country of United States. It has been categorized on Integrated circuit sockets or mounts & Integrated circuit lids & Electronic integrated circuits and microassemblies & Integrated circuit packages. For similar tenders you can see tenders mentioned below of this page.

AR11 - SPACE R&D SERVICES; SPACE FLIGHT, RESEARCH AND SUPPORTING ACTIVITIES; BASIC RESEARCH

General Information

United States

Tender Title :

4H-SiC Silicon Carbide (SiC) Integrated Circuit Processing on 100 mm Diameter SiC Wafers - 80GRC025R7016_RFP
AR11 - SPACE R&D SERVICES; SPACE FLIGHT, RESEARCH AND SUPPORTING ACTIVITIES; BASIC RESEARCH

Tender Type :

Invitation for Bids

Reference No. :

80GRC025R7016_RFP

Country :

United States

Publish Date :

1 Jul 2025

Closing Date :

28 Jul 2025

Notice Language :

English

Tender Categories (CPVs) :

Integrated circuit sockets or mounts , Integrated circuit lids , Electronic integrated circuits and microassemblies , Integrated circuit packages

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4H-SiC Silicon Carbide (SiC) Integrated Circuit Processing on 100 mm Diameter SiC Wafers - 80GRC025R7016_RFP

AR11 - SPACE R&D SERVICES; SPACE FLIGHT, RESEARCH AND SUPPORTING ACTIVITIES; BASIC RESEARCH

General Information

United States

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