Équipement de dépose automatique haute précision de composants sur substrats de 200 et 300 mm

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This tender with title Équipement de dépose automatique haute précision de composants sur substrats de 200 et 300 mm has been published on Bidding Source portal dated 20 Jan 2020 for the country of France. It has been categorized on Microelectronic machinery and apparatus. For similar tenders you can see tenders mentioned below of this page.

General Information

France

Tender Title :

Équipement de dépose automatique haute précision de composants sur substrats de 200 et 300 mm

Tender Type :

Contract notice

Reference No. :

2020/S 012-023268

Country :

France

Province/City :

France-Grenoble

Publish Date :

20 Jan 2020

Closing Date :

14 Feb 2020

Notice Language :

English

Tender Categories (CPVs) :

Microelectronic machinery and apparatus

Full Tender Details :

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Équipement de dépose automatique haute précision de composants sur substrats de 200 et 300 mm

General Information

France

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