loader

World Tenders & Procurement Opportunities

CIRCUITO INTEGRADO AD7572 proceso 70010930-FPM

World Biggest Tenders Source

This tender with title CIRCUITO INTEGRADO AD7572 proceso 70010930-FPM -- INTEGRATED CIRCUIT AD7572 process 70010930-FPM has been published on Bidding Source portal dated 13 Jun 2022 for the country of Chile. It has been categorized on Integrated circuit packages & Electronic integrated circuits and microassemblies & Integrated circuit sockets or mounts & Integrated circuit lids. For similar tenders you can see tenders mentioned below of this page.

INTEGRATED CIRCUIT AD7572 process 70010930-FPM

General Information

CIRCUITO INTEGRADO AD7572 proceso 70010930-FPM
INTEGRATED CIRCUIT AD7572 process 70010930-FPM
Invitation to Tender
729-290-LE22
Chile
13 Jun 2022
28 Jun 2022
Spanish
Integrated circuit packages , Electronic integrated circuits and microassemblies , Integrated circuit sockets or mounts , Integrated circuit lids

For viewing full details of tenders, you should Log in to your account. If not registered yet, Please Register Now

Or Request a call back now and one of our representatives will contact you. Contact us

Similar Tenders

Diodes And Integrated Circuits Solped N°20016172 Rvo -- <br>Diodos Y Circuitos Integrados Solped N°20016172 Rvo Chile CIRCUITOS INTEGRADOS (2-13731 MVV) -- INTEGRATED CIRCUITS (2-13731 MVV) Chile Fluorescent Lighting; Transistor; Integrated Circuit; Resistance; Lampholder for Fluorescent .; Led lamp; Capacitor; Relay - (2x12860-CLS) -- Luminaria Fluorescente; Transistor; Circuito Integrado; Resistencia; Portalámpara p/Fluoresc.; Lámpara Led; Condensador; Relé - (2x12860-CLS) Chile Supply of electronic components and boards (cards with embedded integrated circuits (smart cards). - 6012738 Russia Tsinghua University Integrated Circuit High-Precision Automatic Die Bonding Machine Procurement Project - 7104450 China Procurement of a multi-mode deposition coating system for integrated circuit dielectric materials at the University of Science and Technology Beijing - 9053320 China Procurement of ultra-high vacuum interconnect physical deposition coating system for integrated circuit electrode materials at the University of Science and Technology Beijing - 9053368 China Southeast University School of Integrated Circuits Chip Performance Verification Equipment Procurement - 9114580 China Beihang University School of Integrated Circuit Science and Engineering 2025 28nm Chip Wafer Tape Project - 9112345 China 680350-Awarded - Spain – Electronic integrated circuits and microassemblies – Supply of high-speed communication modules -- <b>Contract Value: 214 164,00 EUR</b> Spain
No. 12, 1 st floor, Block B2, EGS Business Park, World Trade Center, Bakirkoy - Istanbul - Turkey
info@biddingsource.com
24 X 7 online support
TOP
For viewing latest tenders published for your business in all over the World: Sign in Join free
For accessing full details of Tenders, Kindly choose the Plan that works for you: View Subscription Plans