China - SOI silicon wafer procurement of Institute of Microelectronics, Chinese Academy of Sciences

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This tender with title China - SOI silicon wafer procurement of Institute of Microelectronics, Chinese Academy of Sciences has been published on Bidding Source portal dated 18 Sep 2023 for the country of China . It has been categorized on Microelectronic machinery and apparatus. For similar tenders you can see tenders mentioned below of this page.

General Information

China

Tender Title :

China - SOI silicon wafer procurement of Institute of Microelectronics, Chinese Academy of Sciences

Tender Type :

Invitation to Tender

Country :

China

Province/City :

北京市

Publish Date :

18 Sep 2023

Closing Date :

11 Oct 2023

Notice Language :

Chinese

Tender Categories (CPVs) :

Microelectronic machinery and apparatus

Full Tender Details :

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China - SOI silicon wafer procurement of Institute of Microelectronics, Chinese Academy of Sciences

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China

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