loader

World Tenders & Procurement Opportunities

Sun Yat-sen University School of Electronic and Information Engineering Hybrid Integrated Chip Lead Wire Inductively Coupled Plasma Etching System - Gallium Arsenide Indium Phosphide Procurement Project - 06705

World Biggest Tenders Source

This tender with title Sun Yat-sen University School of Electronic and Information Engineering Hybrid Integrated Chip Lead Wire Inductively Coupled Plasma Etching System - Gallium Arsenide Indium Phosphide Procurement Project - 06705 has been published on Bidding Source portal dated 22 May 2025 for the country of China . It has been categorized on Laboratory, optical and precision equipments (excl. glasses) & Phosphides & Chemical elements, inorganic acids and compounds & Cable, wire and related products & Electronic equipment & Wire. For similar tenders you can see tenders mentioned below of this page.

General Information

Sun Yat-sen University School of Electronic and Information Engineering Hybrid Integrated Chip Lead Wire Inductively Coupled Plasma Etching System - Gallium Arsenide Indium Phosphide Procurement Project - 06705
Invitation to Tender
BS-06705
China
广东省
22 May 2025
11 Jun 2025
Chinese
Laboratory, optical and precision equipments (excl. glasses) , Phosphides , Chemical elements, inorganic acids and compounds , Cable, wire and related products , Electronic equipment , Wire

For viewing full details of tenders, you should Log in to your account. If not registered yet, Please Register Now

Or Request a call back now and one of our representatives will contact you. Contact us

No. 12, 1 st floor, Block B2, EGS Business Park, World Trade Center, Bakirkoy - Istanbul - Turkey
info@biddingsource.com
24 X 7 online support
TOP
For viewing latest tenders published for your business in all over the World: Sign in Join free
For accessing full details of Tenders, Kindly choose the Plan that works for you: View Subscription Plans