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679928- France – Microelectronic machinery and apparatus – Acquisition of a component assembly system using the flip-chip method (flip-chip bonder)

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This tender with title 679928- France – Microelectronic machinery and apparatus – Acquisition of a component assembly system using the flip-chip method (flip-chip bonder) has been published on Bidding Source portal dated 21 Oct 2025 for the country of France. It has been categorized on Microelectronic machinery and apparatus. For similar tenders you can see tenders mentioned below of this page.

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France

679928- France – Microelectronic machinery and apparatus – Acquisition of a component assembly system using the flip-chip method (flip-chip bonder)
Invitation for Bids
679928
France
21 Oct 2025
17 Nov 2025
English
Microelectronic machinery and apparatus

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