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天水华天科技股份有限公司 《集成电路多芯片封装扩大规模项目》第二期招标公告

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This tender with title 天水华天科技股份有限公司 《集成电路多芯片封装扩大规模项目》第二期招标公告 -- Tianshui Huatian Technology Co., Ltd. "Integrated Circuit Multi-chip Packaging Scale-up Project" Phase II Tender Announcement has been published on Bidding Source portal dated 09 Nov 2021 for the country of China . It has been categorized on Integrated circuit lids & Electronic integrated circuits and microassemblies & Integrated circuit packages & Integrated circuit sockets or mounts. For similar tenders you can see tenders mentioned below of this page.

Tianshui Huatian Technology Co., Ltd. "Integrated Circuit Multi-chip Packaging Scale-up Project" Phase II Tender Announcement

General Information

China

天水华天科技股份有限公司 《集成电路多芯片封装扩大规模项目》第二期招标公告
Tianshui Huatian Technology Co., Ltd. "Integrated Circuit Multi-chip Packaging Scale-up Project" Phase II Tender Announcement
Invitation for Bids
China
9 Nov 2021
Chinese
Integrated circuit lids , Electronic integrated circuits and microassemblies , Integrated circuit packages , Integrated circuit sockets or mounts

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