Southeast University School of Integrated Circuits Process and Device Design Kit - 6760887

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This tender with title Southeast University School of Integrated Circuits Process and Device Design Kit - 6760887 has been published on Bidding Source portal dated 28 Jul 2025 for the country of China . It has been categorized on Integrated circuit packages & Integrated circuit sockets or mounts & Electronic integrated circuits and microassemblies & Integrated circuit lids. For similar tenders you can see tenders mentioned below of this page.

General Information

China

Tender Title :

Southeast University School of Integrated Circuits Process and Device Design Kit - 6760887

Tender Type :

Invitation to Tender

Reference No. :

6760887

Country :

China

Province/City :

南京市

Publish Date :

28 Jul 2025

Closing Date :

19 Aug 2025

Notice Language :

Chinese

Tender Categories (CPVs) :

Integrated circuit packages , Integrated circuit sockets or mounts , Electronic integrated circuits and microassemblies , Integrated circuit lids

Full Tender Details :

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Southeast University School of Integrated Circuits Process and Device Design Kit - 6760887

General Information

China

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