China - 12nm multi-project wafer MPW tapeout project of the School of Integrated Circuit Science and Engineering, Beihang University - 6093368

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This tender with title China - 12nm multi-project wafer MPW tapeout project of the School of Integrated Circuit Science and Engineering, Beihang University - 6093368 has been published on Bidding Source portal dated 17 Sep 2025 for the country of China . It has been categorized on Integrated circuit sockets or mounts & Integrated circuit packages & Integrated circuit lids & Electronic integrated circuits and microassemblies. For similar tenders you can see tenders mentioned below of this page.

General Information

China

Tender Title :

China - 12nm multi-project wafer MPW tapeout project of the School of Integrated Circuit Science and Engineering, Beihang University - 6093368

Tender Type :

Invitation to Tender

Reference No. :

6093368

Country :

China

Province/City :

北京市

Publish Date :

17 Sep 2025

Closing Date :

10 Oct 2025

Notice Language :

Chinese

Tender Categories (CPVs) :

Integrated circuit sockets or mounts , Integrated circuit packages , Integrated circuit lids , Electronic integrated circuits and microassemblies

Full Tender Details :

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China - 12nm multi-project wafer MPW tapeout project of the School of Integrated Circuit Science and Engineering, Beihang University - 6093368

General Information

China

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