12nm multi-project wafer MPW tapeout project of the School of Integrated Circuit Science and Engineering, Beihang University - 2240042

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This tender with title 12nm multi-project wafer MPW tapeout project of the School of Integrated Circuit Science and Engineering, Beihang University - 2240042 has been published on Bidding Source portal dated 17 Oct 2025 for the country of China . It has been categorized on Integrated circuit packages & Integrated circuit sockets or mounts & Integrated circuit lids & Electronic integrated circuits and microassemblies. For similar tenders you can see tenders mentioned below of this page.

General Information

China

Tender Title :

12nm multi-project wafer MPW tapeout project of the School of Integrated Circuit Science and Engineering, Beihang University - 2240042

Tender Type :

Invitation to Tender

Reference No. :

2240042

Country :

China

Province/City :

北京市

Publish Date :

17 Oct 2025

Notice Language :

Chinese

Tender Categories (CPVs) :

Integrated circuit packages , Integrated circuit sockets or mounts , Integrated circuit lids , Electronic integrated circuits and microassemblies

Full Tender Details :

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12nm multi-project wafer MPW tapeout project of the School of Integrated Circuit Science and Engineering, Beihang University - 2240042

General Information

China

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