Beihang University School of Integrated Circuit Science and Engineering 2025 28nm Chip Wafer Tape Project - 9112345

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This tender with title Beihang University School of Integrated Circuit Science and Engineering 2025 28nm Chip Wafer Tape Project - 9112345 has been published on Bidding Source portal dated 22 Oct 2025 for the country of China . It has been categorized on Electronic integrated circuits and microassemblies & Integrated circuit packages & Integrated circuit lids & Integrated circuit sockets or mounts. For similar tenders you can see tenders mentioned below of this page.

General Information

China

Tender Title :

Beihang University School of Integrated Circuit Science and Engineering 2025 28nm Chip Wafer Tape Project - 9112345

Tender Type :

Invitation to Tender

Reference No. :

9112345

Country :

China

Province/City :

海淀区

Publish Date :

22 Oct 2025

Notice Language :

Chinese

Tender Categories (CPVs) :

Electronic integrated circuits and microassemblies , Integrated circuit packages , Integrated circuit lids , Integrated circuit sockets or mounts

Full Tender Details :

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Beihang University School of Integrated Circuit Science and Engineering 2025 28nm Chip Wafer Tape Project - 9112345

General Information

China

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