Procurement of ultra-high vacuum interconnect physical deposition coating system for integrated circuit electrode materials at the University of Science and Technology Beijing - 9053368

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This tender with title Procurement of ultra-high vacuum interconnect physical deposition coating system for integrated circuit electrode materials at the University of Science and Technology Beijing - 9053368 has been published on Bidding Source portal dated 24 Oct 2025 for the country of China . It has been categorized on Electrodes & Integrated circuit packages & Coating materials & Electronic integrated circuits and microassemblies & Integrated circuit lids & Integrated circuit sockets or mounts. For similar tenders you can see tenders mentioned below of this page.

General Information

China

Tender Title :

Procurement of ultra-high vacuum interconnect physical deposition coating system for integrated circuit electrode materials at the University of Science and Technology Beijing - 9053368

Tender Type :

Invitation to Tender

Reference No. :

9053368

Country :

China

Province/City :

北京市

Publish Date :

24 Oct 2025

Notice Language :

Chinese

Tender Categories (CPVs) :

Electrodes , Integrated circuit packages , Coating materials , Electronic integrated circuits and microassemblies , Integrated circuit lids , Integrated circuit sockets or mounts

Full Tender Details :

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Procurement of ultra-high vacuum interconnect physical deposition coating system for integrated circuit electrode materials at the University of Science and Technology Beijing - 9053368

General Information

China

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