Integrated circuit packages tenders , Page 4

List of Tenders

Total: 81

China - Southeast University's high-energy-efficiency integrated circuit design method and EDA tooling - SiP integrated packaging of ultra-high power density …

Publish Date: 2 Oct 2023

Closing Date:

Country: China

Tender Type: Invitation to Tender

Language: Chinese

China - China Electronics Technology Standardization Institute thermostat (integrated circuit high temperature dynamic aging system) procurement

Publish Date: 25 Sep 2023

Closing Date:

Country: China

Tender Type: Invitation to Tender

Language: Chinese

United States - Integrated Circuits for Clio HSRL EDU - 80NSSC23846002Q

Publish Date: 18 Sep 2023

Closing Date: 22 Sep 2023

Country: United States

Tender Type: Invitation for Bids

Language: English

China - Southeast University's high-energy-efficiency integrated circuit design method and EDA tooling - SiP integrated packaging of ultra-high power density chips

Publish Date: 18 Sep 2023

Closing Date:

Country: China

Tender Type: Invitation to Tender

Language: Chinese

China - Shandong University Digital Integrated Circuit EDA System Procurement

Publish Date: 13 Sep 2023

Closing Date: 11 Oct 2023

Country: China

Tender Type: Invitation to Tender

Language: Chinese

China - Supply of auxiliary equipment for uniform dispensing of the micro-nano platform of the Wuxi Branch of the School of Integrated Circuits (IC) of S…

Publish Date: 11 Sep 2023

Closing Date:

Country: China

Tender Type: Invitation to Tender

Language: Chinese

China - Supply of supporting equipment for micro-nano platform environmental monitoring of the Wuxi Branch of the School of Integrated Circuits of Southe…

Publish Date: 11 Sep 2023

Closing Date:

Country: China

Tender Type: Invitation to Tender

Language: Chinese

China - Supply of supporting equipment for micro-nano platform lithography and development for the Wuxi Branch of the School of Integrated Circuits (IC) …

Publish Date: 11 Sep 2023

Closing Date:

Country: China

Tender Type: Invitation to Tender

Language: Chinese

北京大学集成电路学院家具采购 --

Purchasing furniture for School of Integrated Circuits, Peking University

Publish Date: 7 Aug 2023

Closing Date:

Country: China

Tender Type: Invitation to Tender

Language: Chinese

北京航空航天大学集成电路科学与工程学院SerDes IP采购项目 --

SerDes IP Procurement of School of Integrated Circuit Science and Engineering, Beihang University

Publish Date: 7 Aug 2023

Closing Date:

Country: China

Tender Type: Invitation to Tender

Language: Chinese

Integrated circuit packages tenders

Filter

List of Tenders

Purchasing furniture for School of Integrated Circuits, Peking University

SerDes IP Procurement of School of Integrated Circuit Science and Engineering, Beihang University

info@biddingsource.com